An overclocker cracked the lid off the AMD Zen 4 and it almost looks like a Fallout 4 trash can. Team Red’s Next Best Gaming CPU exposes the underside of the heatsink in a puzzle, giving us an idea of its placement and layout. .
Discovered by Techpowerup, AMD Zen 4 The chip seems to forego the rugged stamp of modern CPUs and uses a fairly crude heatsink. The generic images only show the IHS itself, but the IOD and CCD appear to have been soldered to the cap. This potentially makes it easier to open the CPU cover, but it’s unclear how much damage was actually done in the process.
Zen 4 hasn’t been officially released, so Techpowerup hasn’t revealed who actually disassembled the upcoming processor. AMD CEO Dr. Lisa Su confirmed that the processor will be unveiled later this year at Computex, saying we’ll learn more in the coming months.
The Zen 4 chip cover may look like a piece from Bethesda’s post-apocalyptic RPG, but its design, layout, and materials certainly serve a purpose. The large diameter of the diffuser indicates that the Ryzen 7000 processor generates a lot of heat and moving the CCD may require more efficient heat dissipation.
Image Credit: Techpowerup
AMD’s next-generation processors are expected to compete with Intel’s Raptor Lake lineup, with the Ryzen 7000 said to be clocked at 5.85GHz. Team Blue is also gearing up for upcoming gaming PC processors. generation, with Meteor Lake scheduled for 2023.
Featured Image Credit: Techpowerup
Source : PC Gamesn
